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Constantan Flat Wire Tembaga Nikel Alloy 6j40 Pita 0,4 * 2mm
New Constantan Flat Wire Tembaga Nikel Alloy 6j11 Pita 0.4*2mm
| Ciri khas | Resistivitas (200C μ Ω.m) | Maks.Suhu kerja (0C) | Kekuwatan Tarik (Mpa) | Titik lebur (0C) | Kapadhetan (g/cm3) | TCR x10-6/ 0C (20~600 0C) | EMF vs Cu (μ V/ 0C) (0~100 0C) |
| Nomenklatur Alloy | |||||||
| NC003 (CuNi1) | 0.1 | 200 | ≥ 250 | 1095 | 8.9 | < 100 | -12 |
| Sifat Fisik | Metrik | Komentar |
| Kapadhetan | 8,94 g/cc | |
| Sifat Mekanik | Metrik | Komentar |
| Kekuatan Tarik, Ultimate | 262 – 531 MPa | |
| Kekuwatan Tensile, Ngasilake | 276 – 524 MPa | Gumantung ing watek |
| Elongation ing Break | 46,0 % | ing 50,8 mm. |
| Modulus elastisitas | 115 GPa | |
| Rasio Poissons | 0.310 | diwilang |
| Kemampuan mesin | 20 % | UNS C36000 (free-cutting kuningan) = 100% |
| Modulus geser | 44.0 GPa | |
| Properti Listrik | Metrik | Komentar |
| Resistivitas listrik | 0,0000120 ohm-cm @Suhu 20,0 ° C | |
| Sifat termal | Metrik | Komentar |
| CTE, linear | 17,5 µm/m-° C @Suhu 20.0 – 300 ° C | |
| Kapasitas Panas Spesifik | 0,380 J/g-° C | |
| Konduktivitas termal | 64,0 W/mK @Suhu 20,0 ° C | |
| Titik Lebur | < = 1125 ° C | Liquidus |
| Liquidus | 1125 ° C | |
| Properti Processing | Metrik | Komentar |
| Suhu Annealing | 565 – 815 ° C | |
| Suhu Kerja Panas | 815 – 950 ° C | |
| Sifat Unsur Komponen | Metrik | Komentar |
| Tembaga, Cu | > = 91,2 % | |
| Besi, Fe | 1.30 – 1.70 % | |
| Timbal, Pb | <= 0,050 % | |
| Mangan, Mn | 0,30 – 0,80 % | |
| Nikel, Ni | 4,80 – 6,20 % | |
| Seng, Zn | <= 1.0% |
Kandungan Kimia CuNi44,%
| Ni | Mn | Fe | Si | Cu | Liyane | Arahan ROHS | |||
| Cd | Pb | Hg | Cr | ||||||
| 44 | 1% | 0.5 | - | Bal | - | ND | ND | ND | ND |
Sifat Mekanik
| Max Layanan Terus-terusan Temp | 400ºC |
| Resisivity ing 20ºC | 0,49±5%ohm mm2/m |
| Kapadhetan | 8,9 g/cm3 |
| Konduktivitas termal | -6 (Maks.) |
| Titik Lebur | 1280ºC |
| Kekuwatan Tarik, N/mm2 Anil, Lembut | 340~535 Mpa |
| Kekuwatan Tarik, N/mm3 Cold Rolled | 680~1070 Mpa |
| Elongation (anneal) | 25% (Min) |
| Elongation (digulung dingin) | ≥Min)2%(Min) |
| EMF vs Cu, μV/ºC (0~100ºC) | -43 |
| Struktur Mikrografi | austenit |
| Sifat Magnetik | Non |
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