Paduan Nikel Tembaga (CuNi) minangka bahan tahan medium nganti kurang sing biasane digunakake ing aplikasi kanthi suhu operasi maksimal nganti 400 ° C (750 ° F).
Kanthi koefisien suhu kurang saka resistance electrical, resistance, lan kanthi mangkono kinerja, punika konsisten preduli saka suhu. Tembaga Nikel wesi mechanically gumunggung ductility apik, gampang soldered lan gandheng, uga duwe resistance karat pinunjul. Wesi iki biasane digunakake ing aplikasi saiki dhuwur sing mbutuhake tingkat presisi sing dhuwur.
sasmita | CuNi44 | CuNi23 | CuNi10 | CuNi6 | CuNi2 | CuNi1 | CuNi8 | CuNi14 | CuNi19 | CuNi30 | CuNi34 | CuMn3 | |
Cuprothal | 49 | 30 | 15 | 10 | 5 | ||||||||
Isabellehutte | ISOTAN | Paduan 180 | Paduan 90 | Paduan 60 | Paduan 30 | ISA 13 | |||||||
Komposisi nominal% | Ni | 44 | 23 | 10 | 6 | 2 | 1 | 8 | 14 | 19 | 30 | 34 | – |
Cu | Bal | Bal | Bal. | Bal. | Bal. | Bal. | Bal. | Bal. | Bal | Bal | Bal | Bal | |
Mn | 1 | 0.5 | 0.3 | – | – | – | – | 0.5 | 0.5 | 1.0 | 1.0 | 3.0 | |
Suhu operasi maksimal (uΩ/m ing 20°C) | 0.49 | 0.3 | 0.15 | 0.10 | 0.05 | 0.03 | 0.12 | 0.20 | 0.25 | 0.35 | 0.4 | 0.12 | |
Resisivity (Ω/cmf ing 68°F) | 295 | 180 | 90 | 60 | 30 | 15 | 72 | 120 | 150 | 210 | 240 | 72 | |
Suhu operasi maksimal (°C) | 400 | 300 | 250 | 200 | 200 | 200 | 250 | 300 | 300 | 350 | 350 | 200 | |
Kapadhetan (g/cm³) | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | |
TCR(×10-6/°C) | <-6 | <16 | <50 | <60 | <120 | <100 | <57 | <30 | <25 | <10 | <0 | <38 | |
Kekuatan Tarik (Mpa) | ≥420 | ≥350 | ≥290 | ≥250 | ≥220 | ≥210 | ≥270 | ≥310 | ≥340 | ≥400 | ≥400 | ≥290 | |
Elongasi (%) | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | |
EMF vs Cu uV/°C(0~100°C) | -43 | -34 | -25 | -12 | -12 | -8 | 22 | -28 | -32 | -37 | -39 | - | |
Titik lebur (°C) | 1280 | 1150 | 1100 | 1095 | 1090 | 1085 | 1097 | 1115 | 1135 | 1170 | 1180 | 1050 | |
Sifat Magnetik | ora | ora | ora | ora | ora | ora | ora | ora | ora | ora | ora | ora |