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AG-Cu Silver Tembaga Alloy Wire
sed minangka bahan brazing utama yaiku AgCu7.5, AgCu25, AgCu28,AgCu55, etc., lan AgCu28 digunakake digunakake. Padha duwe konduktivitas apik, fluidity lan wettability, lan digunakake digunakake ing industri vakum listrik. Amarga resistensi sing kurang kanggo beban jangka panjang ing suhu dhuwur, mung cocok kanggo bagian brazing sing suhu kerja luwih murah tinimbang 400ºC.
Digunakake minangka dhuwit recehan lan dekorasi. Paduan sing digunakake minangka koin yaiku AgCu7.5, AgCu8,AgCu10, lsp; wesi sing digunakake minangka hiasan yaiku AgCu8.4, AgCu12.5, lsp
Komposisi normal%
| Ag | Cu | Sn | Ni | Pb | Fe | Sb | Bi | |
| AgCu4 | 96+/-0.3 | 4+0.3/-0.5 | ≤0,005 | ≤0.05 | ≤0,002 | ≤0,002 | ||
| AgCu5 | 95+/-0.3 | 5+0.3/-0.5 | ≤0,005 | ≤0.05 | ≤0,002 | ≤0,002 | ||
| AgCu7.5 | 92.5+/-0.3 | 7.5+0.3/-0.5 | ≤0,005 | ≤0.1 | ≤0,002 | ≤0,002 | ||
| AgCu8.4 | 91.6+/-0.3 | 8.4+/-0.5 | ≤0,005 | ≤0.1 | ≤0,002 | ≤0,002 | ||
| AgCu10 | 90+/-0.3 | 10+/-0.5 | ≤0,005 | ≤0.2 | ≤0,002 | ≤0,002 | ||
| AgCu12.5 | 87.5+/-0.3 | 12.5+/-0.5 | ≤0,005 | ≤0.2 | ≤0,002 | ≤0,002 | ||
| AgCu20 | 80+/-0.3 | 20+/-0.5 | ≤0,005 | ≤0.2 | ≤0,002 | ≤0,002 | ||
| AgCu23 | 77+/-0.5 | 23+/-0.5 | ≤0,005 | ≤0.2 | ≤0,002 | ≤0,002 | ||
| AgCu25 | 75+/-0.5 | 25+/-0.5 | ≤0,005 | ≤0.2 | ≤0,002 | ≤0,002 | ||
| AgCu26 | 74+/-0.5 | 26+/-0.5 | ≤0,005 | ≤0.2 | ≤0,002 | ≤0,002 | ||
| AgCu28 | 72+/-0.5 | 28+/-0.5 | ≤0,005 | ≤0.2 | ≤0,002 | ≤0,002 | ||
| AgCu50 | 50+/-0,5 | 50+/-0,5 | ≤0,005 | ≤0.25 | ≤0,002 | ≤0,002 | ||
| AgCu99 | 1+/-0.2 | 99+0.2/-0.5 | ||||||
| AgCu18Ni2 | 80+/-0.5 | 18+/-0.5 | / | 2+/-0.3 |
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